Model-to-hardware correlation of physics based via models with the parallel plate impedance included

Abstract

The electrical characterization of high speed digital links discontinuities, such as via transitions in printed circuit boards (PCBs), has been widely investigated and numerous modelling attempts can be found in the literature. Among these, so-called models are of special interest. Physics based models use only few elements and a realistic topology to obtain a circuit model that represents with good accuracy the discontinuities the signal undergoes when transitioning layers. In this article a physics based via model is presented with parallel plate impedance included and compared to measurements utilizing a recessed probe launching technique. Comparison of S-parameter data obtained by simulating such models with measured data shows good correlation up to 40 GHz. Measurements and simulations were conducted at the IBM T. J. Watson Research Center.