Preparation of Fine Copper Powder With Chemical Reduction Method and Its Application in MLCC

Abstract

In this paper, the preparation of fine copper powder with chemical reduction method was investigated. Polyhedron nonagglomerated monodispersed copper powders by the reaction of CuSO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> ldr5H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O and ascorbic acid were synthesized at pH 6~7 and reaction temperature of 60degC~70degC. It was also found by X-ray diffraction (XRD) analysis that a mixture of copper and cuprous oxide could be obtained when [Cu(NH <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> ] <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2+</sup> was reduced by ascorbic acid. Reaction temperature and pH have great effects on efficiency and particle size of copper powders. Copper powders were applied as terminal electrode materials of base metal electrode-multilayer ceramic capacitor (BME-MLCC), and the microstructures, including cross section and interface, of copper thick film were discussed with scanning electron microscopy. The results indicated that copper thick film has a loose, porous cross section and a rough interface. The adhesion strength of copper electrode is high due to rough microstructure caused by interfacial reaction.