Publication | Closed Access
Passive Alignment of Optical Elements in a Printed Circuit Board
26
Citations
5
References
2006
Year
Unknown Venue
Optical MaterialsEngineeringPassive AlignmentOptic DesignMechanical EngineeringOptical TestingWafer Scale ProcessingAdvanced Packaging (Semiconductors)Optical PropertiesElectronic PackagingAdapter ElementsNanolithography MethodMaterials SciencePhotonicsPcb Manufacturing ProcessesChip On BoardFabrication TechniqueStandard DeviationFreeform OpticMicroelectronics3D PrintingMicrofabricationApplied PhysicsOptoelectronicsDiffractive Optic
A successful implementation of optics into PCBs (printed circuit boards) requires a precise passive alignment of optical elements relative to the optical waveguides in the board. We tackled this challenge with a novel concept that allows the passive alignment onto a PCB of any optical or optoelectronic building block with a precision of a few micrometers. Markers, structured into a copper layer during manufacturing, are used as a position reference for the polymer waveguide fabrication and for the formation of mechanical alignment features. To form the latter, laser drilling, a standard process for via formation in PCBs, is used. We were able to demonstrate repeated insertions of adapter elements into these alignment slots with a standard deviation of 3 mum for in-plane displacements. Afterwards, optical modules were mounted onto the adapters, using a standard MT interface provided by the adapter. We measured a standard deviation of the order of 5 mum for the in-plane and out-of-plane misalignments of the module with respect to the optical waveguides. The passive alignment concept demonstrated enables accurate and simple plug-in of any kind of element, in particular of optical and opto-electronic elements, into a PCB. The concept is based on established PCB manufacturing processes, which is crucial for the development towards a low-cost optical interconnect technology
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