Nanoparticulated Dense and Stress‐<scp>F</scp>ree Ceramic Thick Film for Material Integration

Abstract

A dense, thick, and organic-binder-free ceramic film consisting of stress-free nanoparticles could be obtained at room temperature by making use of the unstable and high-surface energy amorphous phase on the surface of particles. Photolithography and wet etching can be adapted to the thick ceramic green-state film. A multilayered structure consisting of various ceramics with different sintering temperatures and Cu wiring can form on a Cu foil below 1000 °C.