Publication | Closed Access
RVLSI applications and physical design
15
Citations
2
References
2003
Year
Unknown Venue
EngineeringVlsi DesignElectronic DesignComputer ArchitectureRvlsi ApplicationsIntegrated CircuitsCircuits DensityPhysical Design (Electronics)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)Integrated Circuit DesignModeling And SimulationTesting MethodsElectrical EngineeringIntegrated Power SupplyMicroelectronicsAdvanced PackagingThree-dimensional Heterogeneous IntegrationVlsi ArchitectureVlsi
Improvements in circuits density and yield have permitted restructurable VLSI wafer-scale circuits to be designed with three million transistors. The integrated power supply decoupling capacitors and denser wafer-scale interconnect used in these designs are described. Improved testing methods are required for larger designs.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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