Uprating electronic components for use outside their temperature specification limits

Abstract

Uprating is the process to reduce the risk involved in using components and/or systems outside the manufacturer's environmental specifications. These risks can be segregated into three categories. 1) Die reliability: the capability of the die to operate in the desired environment without physical degradation by mechanisms such as electromigration or oxide breakdown. 2) Package reliability: the capability of the packaged component to withstand exposure to the desired environment without failing. 3) Electrical performance: the capability of the component to perform its electronic function in the desired environment. Successful uprating relies on the fact that there is either a discrepancy between the temperature specification for the system and the actual system operating temperature, or a discrepancy between the temperatures for which the components are sold and the temperatures at which the components can actually operate.