Substrate integrated waveguide with corrugated wall

Abstract

In this work we propose a new SIW structure, called the corrugated SIW (CSIW), which does not require conducting vias to achieve TE <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">10</sub> type boundary conditions at the side walls. Instead, the vias are replaced by quarter wavelength microstrip stubs arranged in a corrugated pattern on the edges of the waveguide. This, along with series interdigitated capacitors, results in a waveguide section comprising two separate conductors, which facilitates shunt connection of active components such as Gunn diodes.