Thermal characterization of high performance MCP with silicon spacer having low thermal impedance

Abstract

This paper presents the thermal optimization of a thermally enhanced FBGA MCP (multichip package). Because of insufficient heat path from top chip to PCB, heat is trapped between chips as shown in computer simulations. To solve the heat trap problem, we designed and developed a thermally enhanced MCP with a silicon spacer, which was applied to a 144 FBGA MCP. An experiment was carried out to verify the thermal characteristics of the thermally enhanced MCP, concerning structural variation and replacement of the adhesive. The experimental results showed that the thermal resistance of the MCP is improved and the low thermal conductive adhesive material is an important heat path barrier.