Proceedings., 39th Electronic Components Conference · 2003 · 15 citations · 1 references
EngineeringMaterials EngineeringMaterials ScienceHeat TransferPolymer ChemistryPolymer EngineeringDielectricsInterconnect TechnologyPolymer Thin FilmsSemiconductor Device MaterialsSilicon MaterialsThermal Properties Of MaterialsDielectric ConstantHigh-density InterconnectsInorganic SubstratesPolyimidesThermal ExpansionThermal Expansion In PolymersThermomechanical Stress
Recent interest in using polyimides for high-density interconnect applications (HDI) in which multilayer structures are formed has created a need for polyimides that have a coefficient of thermal expansion (CTE) matched to that of the underlying substrate. A polyimide chemistry that allows for a significant lowering of the CTE and subsequent reduction of stress on silicon and ceramic substrates while giving improved dielectric constant
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