Publication | Closed Access
In-plane and out-of-plane mass transport during metal-assisted chemical etching of GaAs
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Citations
21
References
2014
Year
SemiconductorsMaterials ScienceElectrical EngineeringChemical EngineeringEngineeringPhysicsAu CatalystsNanotechnologyMetal-assisted Chemical EtchingCatalyst ThicknessApplied PhysicsSemiconductor Device FabricationOut-of-plane Mass TransportPlasma EtchingOptoelectronicsCompound SemiconductorSemiconductor Nanostructures
We have demonstrated the dependence of the metal-assisted chemical etching of GaAs on catalyst thickness. For ultra-thin (3~10 nm) Au catalysts, we found that electrochemically generated nano-pinholes in the metal catalyst not only enhance important catalytic effects in redox reactions, but also act as a diffusion pathway for the reactants (H<sub>2</sub>SO<sub>4</sub>) and products (Ga<sup>3+</sup> and As<sup>n+</sup> ions) for chemical etching oxidized GaAs.
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