IEEE Transactions on Electron Devices · 2006 · 22 citations · 9 references
Electrical EngineeringPhotoelectric SensorEngineeringHigh SensitivityNanoelectronicsMixed-signal Integrated CircuitUltrafine Pixel SizeApplied PhysicsImage ProcessorComputer EngineeringSensor DesignInstrumentationPixel SizeMicroelectronicsOptoelectronicsImage Sensor
In this paper, an ultrafine pixel size (2.0/spl times/2.0 /spl mu/m/sup 2/) MOS image sensor with very high sensitivity is developed. The key technologies that realize the MOS image sensor are a newly developed pixel circuit configuration (1.5 transistor/pixel), a fine 0.15-/spl mu/m design rule, and an amorphous Si color filter (Si-CF). In the new pixel circuit configuration, a unit pixel consists of one photodiode, one transfer transistor, and an amplifier circuit with two transistors that are shared by four neighboring pixels. Thus, the unit pixel has only 1.5 transistors. The fine design rule of 0.15 /spl mu/m enables reduction of wiring area by 40%. As a result, a high aperture ratio of 30% is achieved. A newly developed Si-CF realizes the 1/10 thickness of that of the conventional organic-pigment CF, giving rise to high light-collection efficiency. With these three technologies combined, a high sensitivity of 3400 electrons/lx/spl middot/s is achieved even with a pixel size of 2.0/spl times/2.0 /spl mu/m/sup 2/.
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256×256 CMOS active pixel sensor camera-on-a-chip
Robert H. Nixon, Sabrina E. Kemeny, Bedabrata Pain et al. · IEEE Journal of Solid-State Circuits · 1996 · 161 citations
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CMOS imager technology shrinks and image performance
H. Rhodes, Gennadiy Agranov, Chenglin Hong et al. · 2004 · 53 citations
Imager Design Rules, Electrical Engineering, Engineering +12