IEEE Electron Device Letters · 2005 · 316 citations · 16 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsNanomaterialsNanotechnologyCarbon NanotubesIntegrated Circuit DesignInterconnect DesignInterconnect TechnologyNanoelectronicsNanotubesCopper InterconnectsHigh-speed InterconnectsInterconnect IntegrationNanoelectronic Interconnects
Physical models are used to determine the ultimate potential performance of carbon nanotube interconnects and compare them with minimum-size copper wires implemented at various technology generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube bundles with larger wave speeds must be used. At the 45-nm node (year 2010), the performance enhancement that can be achieved by using nanotube bundles is negligible, and at the 22-nm node (year 2016) it can be as large as 80%.
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High-Field Electrical Transport in Single-Wall Carbon Nanotubes
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Electron−Phonon Scattering in Metallic Single-Walled Carbon Nanotubes
Nano Letters · 2004 · 639 citations · Full text