2008 · 125 citations · 46 references
Natural SciencesMaterials EngineeringMaterials ScienceAgingElectronic MaterialsMechanical Behavior Of MaterialsAging AnalysisAging EffectsAlloysCreep BehaviorCreep DeformationMaterial DegradationAging BehaviourAging TestsAlloy Creep BehaviorCreep AgingCreep MechanismsMaterial Behaviour At Elevated TemperaturesSolder Joint StrengthTemperature Dependence Of Creep
The effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0-4 months) at room temperature (25degC), and several elevated temperatures (75, 100, and 125 degC). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the creep properties were observed and modeled as a function of aging time and aging temperature. In addition, the chosen selection of SAC alloys has allowed us to explore the effects of silver content on aging behavior.
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Effect of thermal aging on board level drop reliability for Pb-free BGA packages
Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations