IEEE Transactions on Components Hybrids and Manufacturing Technology · 1984 · 28 citations · 5 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationSemiconductor DevicesElectrical ConductivityElectrical Properties Of CeramicsGlass MaterialsMicrostructure ControlThin Film Electrical PropertiesThin-film MaterialsElectrical PropertiesElectrical Properties AnalysisParticle-size DistributionResistors
The microstructure and electrical properties of RuO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> thick film resistors have been studied with special emphasis on the effects of material parameters and processing variables such as size of glass frit particles, RuO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> -glass mixing ratio, firing conditions, and so forth. A network of RuO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> develops in a glass matrix on firing, and the increase in the glass particle size enlarged the cell in the network without any significant change in the microstructure. It is shown that a decrease in particle size of glass frit increases the resistance and causes the temperature coefficient of resistor (TCR) to take negative values.
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A. Cattaneo, M. Cocito, F. Forlani et al. · Active and Passive Electronic Components · 1977 · 33 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17