A low-power RISC microprocessor using dual PLLs in a 0.13 μm SOI technology with copper interconnect and low-k BEOL dielectric

D. Appenzeller, E. Cohen, Serge A. Charlebois, P. Kartschoke, P. McCormick, Norman J. Rohrer, G. Salem, Peter A. Sandon, Ben Singer, T. Von Reyn,

2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315) · 2003 · 26 citations · 3 references

Concepts

Abstract

Microprocessors achieving clock frequencies >1 GHz for mobile applications require solutions to maintain long battery life. Circuit and architecture solutions for dynamic frequency switching between multiple PLLs, DC power reduction methods, and impact of low-k dielectric on timing and power are discussed.

References

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