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XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer

Materials ScienceMaterials EngineeringDiamond-like CarbonEngineeringMicrofabricationNanometric CuttingXps AnalysisMechanical EngineeringApplied PhysicsMaterial MachiningTool WearMachine ToolSemiconductor Device FabricationDiamond ToolMicroelectronicsMicrostructure