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Surface Passivation of Boron-Diffused p-Type Silicon Surfaces With (1 0 0) and (1 1 1) Orientations by ALD Al$_{2}$O$_{3}$ Layers
36
Citations
26
References
2013
Year
Materials ScienceAluminium NitrideSurface CharacterizationSemiconductor TechnologyEngineeringBoron NitrideAluminum OxideSurface AnalysisSurface ScienceApplied PhysicsAld AlSurface PassivationSemiconductor MaterialSemiconductor Device FabricationThin FilmsSilicon On InsulatorUndiffused Silicon SamplesAtomic Layer Deposition
Boron-diffused p+/n/p+ and undiffused silicon samples with (1 0 0) and (1 1 1) orientations passivated by aluminum oxide (Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) that is synthesized by atomic layer deposition (ALD) have been investigated. Emitter saturation current densities of ~24, 29, and 33 fA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> were obtained for (1 0 0) samples with symmetrical 85Ω/□ B diffusions that were passivated by plasma-assisted, H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O-based, and O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> -based ALD Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> , respectively. Compared with undiffused samples, it was found that the additional surface doping from the diffusion reduces recombination at the Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /Si interface in the case of relatively low surface boron concentrations (<; 2×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">19</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> ). The degree of surface passivation that is observed on (1 0 0) surfaces was generally better than on (1 1 1) surfaces, particularly for undiffused samples, but this difference effectively disappeared following the application of more negative charge by corona charging. From capacitance- voltage measurements, it was found that Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> films on substrates with a (1 0 0) orientation display a higher negative fixed charge density Q <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</sub> than films on (1 1 1) samples. On the other hand, the interface state density D <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub> was not strongly influenced by surface orientation of the substrate. It appears that the difference in negative charge density is at least partly responsible for the differences in the observed passivation.
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