A systems perspective on digital interconnection technology

Abstract

The work describes, from a switching system designers perspective, present digital interconnection technologies and needs. The discussion begins at the chip-to-chip interconnection level and proceeds to the frame-to-frame level. The authors evaluate the optimal packaging and interconnection technology that should be used in future system designs. The analysis suggests that parallel optical data links based on a laser array technology implemented at the board-to-board level are presently advantageous. This analysis, as well as a detailed description of laser gate arrays, is also included.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>