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Horizontal Current Bipolar Transistor With a Single Polysilicon Region for Improved High-Frequency Performance of BiCMOS ICs
40
Citations
10
References
2010
Year
Single-poly HcbtElectrical EngineeringSingle Polysilicon RegionEngineeringVlsi DesignElectronic EngineeringMixed-signal Integrated CircuitBias Temperature InstabilityComputer EngineeringBicmos IcsImproved High-frequency PerformanceCmos Gate PolysiliconIntegrated CircuitsMicroelectronicsBeyond Cmos
A new horizontal current bipolar transistor (HCBT) with a single polysilicon region and a CMOS gate polysilicon near the n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> emitter region is integrated with CMOS technology with the addition of two or three masks (three or four masking steps) and a small number of additional fabrication steps. The single-poly HCBT with an optimized collector exhibits f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> and f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 51 and 61 GHz, respectively, and an f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> BV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CEO</sub> product of 173 GHz · V, which are the best reported HCBT characteristics to date and among the highest performance Si BJTs. An HCBT with only two additional masks to CMOS has f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> and f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 43 and 53 GHz, respectively, and an f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> SV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">CEO</sub> product of 120 GHz · V. The developed innovative fabrication techniques enable a very low-cost BiCMOS platform for wireless communication circuits.
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