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Non-planar interconnects in double-sided flexible Cu-PET substrates using a laser-assisted maskless microdeposition process: 3D finite element modeling and experimental analysis

Materials ScienceNon-planar InterconnectsWafer Scale ProcessingEngineeringFlexible ElectronicsMicrofabricationFinite Element ModelingExperimental AnalysisMechanical EngineeringApplied PhysicsSurface SciencePrinted ElectronicsFabrication TechniqueElectronic PackagingMicroelectronics3D PrintingNanolithography Method