Concepedia

Influence of process parameters on microstructure of transient liquid phase bonded Inconel 738LC superalloy with Amdry DF-3 interlayer

N.P. Wikstrom, O.A. Ojo, M.C. Chaturvedi

Materials Science and Engineering A · 2005 · 64 citations · 12 references

DOI

Concepts

References

12

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

, , +11

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

, , +13

High Temperature Alloys for Gas Turbines and Other Applications 1986

G.S. Kitteringham · High Temperature Technology · 1987 · 262 citations

, , +14

Influence of coherency stress on microstructural evolution in model Ni-Al-Mo alloys

Michael G. Fahrmann, Peter Fratzl, Oskar Paris et al. · Acta Metallurgica et Materialia · 1995 · 192 citations

, , +14

Microstructural development in transient liquid-phase bonding

William F. Gale, E. R. Wallach · Metallurgical Transactions A · 1991 · 143 citations

, , +14