The impact of embedded wafer level BGA package on the antenna performance

Abstract

In this article, we present a study about the impact of embedded wafer level ball grid array (eWLB) on characteristics of antenna. The antenna in package is a promising solution for integration of antennas and eWLB technology enables integration of passive components and antennas into the redistribution layer (RDL). The antenna radiates perpendicular to the package in broadside into the package. There are different parameters such as size, shape, and thickness of the eWLB package which affect the radiation pattern significantly. Moreover, the materials properties of package like relative permittivity (ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> ) and loss tangent (tanδ) impact the impedance bandwidth, gain and efficiency of antenna and have to be taken into account. The other important parameter to design the antenna in package is the distance of antenna to the reflector. We present the feasibility of an antenna with backside metallization as an integrated reflector in an 8 mm × 8 mm eWLB package. The measurement and simulation results show that eWLB is an attractive candidate for mm-wave applications.