Publication | Closed Access
Optimization of cubic GaN growth by metalorganic chemical vapor deposition based on residual strain relaxation
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Citations
11
References
2003
Year
Materials ScienceMaterials EngineeringElectrical EngineeringCubic Gan GrowthResidual Strain RelaxationThick Gan LayerCrystalline DefectsEngineeringAluminium NitrideWide-bandgap SemiconductorApplied PhysicsAluminum Gallium NitrideGan Power DeviceGallium OxideThin FilmsCategoryiii-v SemiconductorResidual Strain
The reduction of residual strain in cubic GaN growth by inserting a thermoannealing process is investigated. It is found that the epilayer with smaller tensile strain is subject to a wider optimal “growth window.” Based on this process, we obtain the high-quality GaN film of pure cubic phase with the thickness of 4 μm by metalorganic chemical vapor deposition. The photoluminescence spectrum at room temperature shows the thick GaN layer has a near-band emission peak with a full width at half maximum of 42 meV which confirms its high crystal quality, further supported by the x-ray (002) diffraction measurement. A simplified model is demonstrated to interpret this strain effect on the growth process.
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