Publication | Closed Access

Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers

Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityChip On BoardApplied PhysicsReliability EvaluationChip AttachmentLow-k WafersElectronic PackagingMicroelectronics