Ablation and etching of polymethylmethacrylate by very short (160 fs) ultraviolet (308 nm) laser pulses

Abstract

The effect of pulse width on the ablation of polymers has been extended to ultrashort pulses (160 fs) of 308 nm wavelength. Polymethylmethacrylate has negligible absorption at this wavelength for one-photon excitation. With the ultrashort pulse clean etching without any sign of thermal damage can be achieved at fluences as little as 0.2–0.3 J/cm2. This is the first demonstration that the high power of ultrashort pulses of ultraviolet light can produce photochemical etching by taking advantage of multiphoton excitation to dissociative states.