IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling - Concepedia

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IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

31

Citations

42

References

2014

Year

Donghua Yang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Liangliang Li

Journal of Materials Science Materials in Electronics

Materials ScienceMaterials EngineeringImc GrowthEngineeringApplied PhysicsThermal CyclingShear Strength

References

	Year	Citations

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