Concepedia

The use of conducting polymers and colloids in the through hole plating of printed circuit boards

H. Meyer, Richard J. Nichols, D. Schröer, Lutz Stamp

Electrochimica Acta · 1994 · 33 citations · 2 references

DOI

Concepts

References

2

An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive

Richard J. Nichols, Wolfgang Beckmann, H. Meyer et al. · Journal of Electroanalytical Chemistry · 1992 · 106 citations

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Applications of SPM in the metal plating industry

Richard J. Nichols, D. Schröer, H. Meyer · Scanning · 1993 · 18 citations

, , +10