Novel exposure methods based on reflection and refraction effects in the field of SU-8 lithography

Abstract

Thick-film photolithography based on SU-8 has gained great interest in the field of microreplication technologies. For replication applications the SU-8 structures themselves or electroplated copies of the resist structures are used as casting or embossing tools. In this paper, a simple estimation model is proposed to predict the sidewall profiles of SU-8. This model is based on the effects of Fresnel diffraction and absorption resulting in useful approximations for the pattern profile of SU-8. Its usefulness is successfully verified by experimental results; the estimated and experimental results show similar trends. In addition, by utilizing this model two exposure methods based on reflection and refraction could be developed which avoid negatively sloped sidewall profiles of SU-8. Using these exposure methods, SU-8 preforms without undercut for the replication of optical waveguides have been achieved.