Publication | Closed Access
Impact of the layout on the electrical characteristics of double-sided silicon 3D sensors fabricated at FBK
17
Citations
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References
2012
Year
Electrical Characteristics3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationNanoelectronicsApplied PhysicsComputer EngineeringSensor DesignElectronic PackagingMicroelectronicsDouble-sided Silicon 3DInterconnect (Integrated Circuits)
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