Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

An overview of high-temperature electronic device technologies and potential applications

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Advantages and new development of direct bonded copper substrates

J. Schulz‐Harder · Microelectronics Reliability · 2003 · 160 citations

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Physical limits and lifetime limitations of semiconductor devices at high temperatures

W. Wondrak · Microelectronics Reliability · 1999 · 81 citations

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Reliability of AlN substrates and their solder joints in IGBT power modules

G. Mitić, R. Beinert, P. Klofac et al. · Microelectronics Reliability · 1999 · 36 citations

Engineering, Electrical Engineering, Materials Engineering +16

Electrical characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications

Laurent Dupont, Z. Khatir, Sébastien Lefebvre et al. · 2005 · 17 citations · Full text

Engineering, Electrical Engineering, Materials Science +17