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Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringPower AssembliesHardware ReliabilityMetallization ThicknessCeramic MaterialMechanical EngineeringStructural CeramicElectronic PackagingHeat TransferHigh Temperature CyclingThermal EngineeringMicrostructure