Publication | Closed Access
Origin of forward leakage current in GaN-based light-emitting devices
166
Citations
11
References
2006
Year
Electrical EngineeringSolid-state LightingEngineeringDifferent GanApplied PhysicsNew Lighting TechnologyAluminum Gallium NitridePit DensityGan Power DeviceLight-emitting DiodesForward LeakageCategoryiii-v SemiconductorOptoelectronicsThin Gan Template
The authors fabricated GaN-based light-emitting diodes (LEDs) on two different GaN templates with the same LED structure. One on thin GaN template (∼2μm) with high dislocation density [low (109cm−2)] grown by metal-organic vapor-phase epitaxy (sample A) and the other on thick GaN template (∼20μm) with comparatively low dislocation density [high (108cm−2)] by hydride vapor-phase epitaxy (sample B). In order to understand the mechanism of leakage current in LEDs, the correlation between current-voltage characteristics and etch pit density of LEDs was studied.
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