Publication | Closed Access
Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material
25
Citations
12
References
2007
Year
Materials ScienceAdvanced PackagingMaterials EngineeringElectrical EngineeringEngineeringThermal InsulationThermal Conductive PropertiesThermal ConductivityElectronic PackagingThermal ConductionNi–p ElectrolessThermal PropertyThermal Properties
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