Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects - Concepedia

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Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects

27

Citations

3

References

2005

Year

M. Traving, I. Zienert, Ehrenfried Zschech, G. Schindler, W. Steinhögl, M. Engelhardt

Applied Surface Science

Electrical EngineeringEngineeringTunneling MicroscopyInterconnect (Integrated Circuits)Applied PhysicsPhase AnalysisTan/ta Barrier LayersSub-micrometer Trench StructuresMicroelectronicsMicrostructure

References

	Year	Citations

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