Room temperature silicon wafer bonding with ultra‐thin polymer films

Abstract

Bonding of silicon wafers is required in microelectronics fabrication, for example. A room‐temperature bonding process that leads to sufficient bond strength is necessary for bonding semi‐processed wafers, i.e., those already containing temperature‐sensitive structures. The room‐temperature bonding of hydrophobic wafers is reported for the first time, an ultra‐tin Langmuir‐Blodgett film of a “hairy” rod‐like polymer being used as an intermediate layer. The effect of the polymer layer on the surface roughness is investigated and possible directions o future work are indicated.