Journal of Electronic Packaging · 1992 · 12 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsHeat TransferThin FilmsStrength Of MaterialsThermal Properties Of MaterialsThermal StressesThin Film AdhesionThin Film Mechanical PropertiesThin Film Thermal PropertiesAdhesive Layer PerformanceAdhesive Layer ThicknessLayer Thickness EffectsMaterial Property EffectsMaterial Thickness EffectsResidual Thermal StressesSolder PastesThermomechanical Stress
Research Papers Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer An-Yu Kuo, An-Yu Kuo Structural Integrity Associates, Inc., San Jose, CA 95118 Search for other works by this author on: This Site PubMed Google Scholar Kuan-Luen Chen Kuan-Luen Chen Structural Integrity Associates, Inc., San Jose, CA 95118 Search for other works by this author on: This Site PubMed Google Scholar Author and Article Information An-Yu Kuo Structural Integrity Associates, Inc., San Jose, CA 95118 Kuan-Luen Chen Structural Integrity Associates, Inc., San Jose, CA 95118 J. Electron. Packag. Jun 1992, 114(2): 199-202 (4 pages) https://doi.org/10.1115/1.2906418 Published Online: June 1, 1992 Article history Received: August 1, 1991 Online: April 28, 2008