Simulation of thermal stresses due to grinding - Concepedia

Concepedia

Publication | Closed Access

Simulation of thermal stresses due to grinding

109

Citations

21

References

2001

Year

P. Moulik, Henry T. Y. Yang, Srinivasan Chandrasekar

International Journal of Mechanical Sciences

EngineeringMechanicsMaterial MachiningMechanical EngineeringSolid MechanicsThermal StressesThermomechanical AnalysisThermal EngineeringThermomechanical ProcessingMechanics Of Materials

References

	Year	Citations

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