Effect of Joint Thickness and Residual Stresses on the Properties of Ceramic Adhesive Joints: II, Experimental Results

Abstract

The residual stresses in joints were varied by varying the thickness and thermal expansion mismatch of joints prepared using alumina adherends and silicate glass adhesives. An apparent fracture toughness was measured by the single‐edge notchedbeam method; strengths were measured in flexure, and the fracture surfaces were studied. Stress distributions, determined using the finite element method in Part I, together with the results of literature analyses for stresses in joints subjected to externally applied loads, were used to aid in interpreting the experimental observations. The measured fracture toughness and strength of ceramic adhesive joints increase with decreasing adhesive thickness and decrease with increasing thermal expansion mismatch (residual stress), both positive and negative.