A utility-based integrated process simulation system

Abstract

The effectiveness of a utility-based process simulation system is demonstrated by investigating several current VLSI technology problems with a variety of powerful simulators. Interactions of deposition, etching and spin-on steps in a planarization process are investigated with topography and creeping flow simulators. Topography and thermal processing simulators are combined to investigate a complete bipolar device process. Simulators for 2-D image calculation and scattering from topography are applied to problems in submicron lithography. The primary platform used for utility-based software integration is SIMPL-DIX which connects layout and process flow data, and an X-window graphical user-interface, into a system for generating device cross-sections. An experimental adaptation of SIMPL into the OCT/VEM/RPC CAD framework has also been developed that provides access to the VEM user-interface, the OCT database, a mask editor, and circuit CAD tools