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Effects of the deposition temperature on the resistivity of copper films produced by low-pressure metal-organic chemical vapour deposition on a TiN barrier layer

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSpecific ResistanceSurface ScienceApplied PhysicsCopper FilmsTin Barrier LayerThin FilmsChemical DepositionDeposition TemperatureChemical Vapor DepositionThin Film Processing