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Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Computer ArchitectureComputer EngineeringThree-dimensional Integrated CircuitsModeling And SimulationElectronic PackagingMicroelectronics3D IntegrationInterconnect (Integrated Circuits)Ic Stack