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Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging

Materials EngineeringMaterials ScienceElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationWafer Scale ProcessingApplied PhysicsMems Wafer-level PackagingChip AttachmentElectronic PackagingMicroelectronicsMaterial SystemsInterconnect (Integrated Circuits)