Residual stress and in-situ thermal stress measurement of aluminum film deposited on silicon wafer - Concepedia

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Residual stress and in-situ thermal stress measurement of aluminum film deposited on silicon wafer

36

Citations

7

References

1996

Year

Kazuya Kusaka, T. Hanabusa, M. Nishida, Fukuji Inoko

Thin Solid Films

Materials ScienceWafer Scale ProcessingEngineeringAluminum FilmApplied PhysicsSilicon WaferStressstrain AnalysisResidual StressSemiconductor Device FabricationElectronic PackagingDevice ReliabilityMechanics Of Materials

References

	Year	Citations

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