Characterization of micromechanical structures using white-light interferometry

Abstract

As microelectromechanical systems (MEMS) move rapidly towards commercialization, the issue of mechanical characterization has emerged as a major consideration in device design and fabrication. It is now common to include a set of test structures on a MEMS wafer for extraction of thin film material properties (in particular, residual stress, stress gradient and Young's modulus), and for process and device monitoring. These structures usually consist of micromachined beams and strain gauges. Measurement techniques include tensile testing, scanning electron microscopy (SEM) imaging, atomic force microscopy (AFM) analysis, surface profiling and Raman spectroscopy. However, these tests are often destructive and may be difficult to carry out at the wafer scale.