Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens - Concepedia

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Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens

37

Citations

21

References

2005

Year

Adwait U. Telang, Thomas R. Bieler, M.A. Crimp

Materials Science and Engineering A

Materials ScienceThermomechanical CyclingEngineeringMechanical EngineeringThermodynamicsSpecial BoundariesThermomechanical AnalysisThermomechanical ProcessingMechanics Of MaterialsMicrostructure

References

	Year	Citations

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