Journal of Electronics Cooling and Thermal Control · 2011 · 26 citations · 2 references
EngineeringMechanical EngineeringHeat TransferThermal AnalysisThermodynamicsCooling SystemsHeat ConductionHeat Transfer In FluidsHeat Transfer ModelingThermal DesignThermal ManagementCooling System DesignCooling TechniquesForced ConvectionForced Convection CoolingHeat Sink Thermal ModelingHeat SinksIndirect CoolingIntegrated Cooling Systems
A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.
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