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Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

45

Citations

26

References

2008

Year

Abstract

This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir

References

YearCitations

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