Bulletin of the Chemical Society of Japan · 1974 · 15 citations · 4 references
Natural SciencesChemistryMaterials ScienceElectrochemistryInorganic ChemistryMetallic MaterialsCharge Transfer ReactionsElectrochemical KineticsElectrode KineticsElectrode MaterialsElectrode-electrolyte InterfacesElectrolyte SolutionsElectrochemical BehaviorElectrochemical MechanismsElectrochemical Reaction MechanismsElectrode Reaction MechanismsHydrogen EvolutionHydrogen Evolution ReactionHydrogen Evolution Reaction KineticsMetal Oxide Electrodes
Abstract The present author has been studying the electrodeposition of metals from non-aqueous solutions of metal trifluoroacetates. In the present study, the properties of the Cu(CF3COO)2–HCONH2 bath and the Ni(CF3COO)2–HCONH2 bath, and the mechanism of the electrodeposition of copper and nickel from these baths, were studied. Both Cu(CF3COO)2 and Ni(CF3COO)2 were easily dissolved in formamide. The specific conductance of these solutions was high. Satisfactory electrodeposits are obtained from these solutions, with a high current efficiency. The cross-section of the electrodeposits showed a granular structure. The rate of the electrodeposition of copper from the Cu(CF3COO)2–HCONH2 bath and that of nickel from the Ni(CF3COO)2–HCONH2 bath were controlled by the charge-transfer reaction at low current densities. The activation overvoltage of the hydrogen-evolution reaction for the electrolysis of the CF3COOH–HCONH2 bath was higher than that for the electrolysis of the CF3COOH–H2O bath.
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