Strains and crystal lattice defects arising in macroporous silicon under oxidation

Abstract

The deformation behavior of a macroporous silicon wafer subjected to high-temperature oxidation has been studied, and the basic parameters describing the sample bending and subsequent stress relaxation when oxide is removed are determined. X-ray diffractometry and topography were used to determine the sample bending radius and lattice parameters, and to reveal the areas of dislocation generation. The strain of a silicon lattice in oxidized macroporous Si is about 10−4, and it decreases by an order of magnitude after oxide dissolution. The plastic part of the strain is accompanied by the generation of dislocations in the most strained regions of a structure, i.e., at the interfaces between the porous layer and substrate in the vertical direction and between the central porous region and the pore-free edge in the horizontal plane. The dislocation density is ∼104 cm−2.