Application of selective CVD tungsten for low contact resistance via filling to aluminum multilayer interconnection - Concepedia

Concepedia

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Application of selective CVD tungsten for low contact resistance via filling to aluminum multilayer interconnection

10

Citations

6

References

1988

Year

Sung Min Rang, Robert H. Chow, R. H. Wilson, B. Gorowitz, A. G. Williams

Journal of Electronic Materials

Materials ScienceMaterials EngineeringElectrical EngineeringLow Contact ResistanceEngineeringSelective Cvd TungstenSurface ScienceApplied PhysicsMultilayer InterconnectionVacuum DeviceElectronic PackagingMicroelectronicsSurface ProcessingChemical Vapor DepositionInterconnect (Integrated Circuits)

References

	Year	Citations

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