Electrical contactswith low resistance for melt‐processed high‐<i>T</i>_c Superconductors

Abstract

Low electrical resistance and high thermal and mechanical stability are required of the materials used to connect ssuperconducting materials with normal conducting leads. The sputter deposition of silver or gold layers into melt‐processed BSCCO superconducting material results in contacts in the mω range which is too high for high‐current applications. An alternative method is presented which takes advantage of the BSCCO production method and requires no additional processing steps.